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Dual Interface

Full Auto Spot Tin & Glue Laminating Machine
Automatic Dual Interface Card Implanting Machine

function:

The machine is designed for applying tin to antenna connection leads of dual interface chip, milling tin joints flat and laminating at the back of chip.

Features:

  • PLC and servo system control.
  • Tin fusion temperature controlled by the temperature controller to melt the tin wires to the antenna connection leads.
  • Linear motor with two milling heads to ensure height precision of tin joints.
  • Adhesive punch station and hot pressing head to apply adhesive at the back of chip after tin welding.
  • Automatic cleaning station for tin welding head and tin joints milling to ensure the welding precision.
  • IC module tape loading/unloading station.
  • Double heads design for tin welding, tin joints milling and hot-melt adhesive applying.

Tech. Specification

Outline Dimension: (L) 1600mm x (W) 800mm x (H) 1850mm

Weight: 600Kg

Work station: IC module tape input station/Tin welding station/Milling head station/Cleaning station/adhesive punching station/adhesive applying station/IC module tape collecting station

Speed: 2000 pcs/hour

Height accuracy of tin joint: ��0.02mm
Yield: 99.5%
Application material: Dual interface module tape, customized tin wire, hot adhesive
Temperature (Range): 130
��~300��
PVC thickness : 0.1mm~0.35mm

Operation requirement:

Environment: constant temperature 22��, �� 3��, dry and dust free.

Power: AC 220V (single phase), 50/60Hz.

Air pressure: 6kg/cm2  clean, dry and oil-free.

Operator: one person

Notes: above specification is subject to change without prior notice due to continuous improvement.